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S71WS256PC0HH3YR0

Manufacturer

Spansion
Manufacturer's Part Number

S71WS256PC0HH3YR0
Description

FLASH; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA84,10X12,32;
Datasheet

Datasheet

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S71WS256PC0HH3YR0 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	16MX16
Maximum Seated Height:	1.2 mm
Programming Voltage (V):	1.8
Minimum Supply Voltage (Vsup):	1.7 V
Sub-Category:	Other Memory ICs
Surface Mount:	YES
No. of Terminals:	84
No. of Words:	16777216 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B84
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TFBGA
Width:	8 mm
Memory Density:	268435456 bit
Mixed Memory Type:	FLASH+PSRAM
Memory IC Type:	FLASH
Minimum Operating Temperature:	-25 Cel
Memory Width:	16
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA84,10X12,32
Length:	11.6 mm
Maximum Access Time:	80 ns
No. of Words Code:	16M
Nominal Supply Voltage / Vsup (V):	1.8
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	1.95 V
Power Supplies (V):	1.8

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