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PC28F256P33TFE

Manufacturer

Micron Technology
Manufacturer's Part Number

PC28F256P33TFE
Description

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
Datasheet

Datasheet

Not In Stock

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PC28F256P33TFE Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00021 Amp
Organization:	16MX16
Maximum Seated Height:	1.2 mm
Programming Voltage (V):	3
Minimum Supply Voltage (Vsup):	2.3 V
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	31 mA
Command User Interface:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	64
No. of Words:	16777216 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B64
No. of Sectors/Size:	4,255
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TBGA
Width:	10 mm
Boot Block:	TOP
Memory Density:	268435456 bit
Sector Size (Words):	16K,64K
Toggle Bit:	NO
Memory IC Type:	FLASH
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
No. of Functions:	1
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA64,8X8,40
Common Flash Interface:	YES
Length:	13 mm
Maximum Access Time:	95 ns
No. of Words Code:	16M
Nominal Supply Voltage / Vsup (V):	3
Additional Features:	TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V
Data Polling:	NO
Power Supplies (V):	2.5/3.3

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PC28F256P33TFE Technical Details

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