S25FL256SAGNFB000 by Infineon Technologies

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S25FL256SAGNFB000

Manufacturer

Infineon Technologies
Manufacturer's Part Number

S25FL256SAGNFB000
Description

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Memory Density: 268435456 bit;
Datasheet

Datasheet

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S25FL256SAGNFB000 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	64MX4
Maximum Seated Height:	.8 mm
Programming Voltage (V):	3
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
Terminal Finish:	MATTE TIN
Maximum Write Cycle Time (tWC):	500 ms
No. of Terminals:	8
Maximum Clock Frequency (fCLK):	133 MHz
No. of Words:	67108864 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Screening Level:	AEC-Q100
Technology:	CMOS
JESD-30 Code:	R-PDSO-N8
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	105 Cel
Package Code:	HVSON
Width:	6 mm
Moisture Sensitivity Level (MSL):	3
Memory Density:	268435456 bit
Memory IC Type:	FLASH
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
Memory Width:	4
No. of Functions:	1
Alternate Memory Width:	2
Length:	8 mm
No. of Words Code:	64M
Nominal Supply Voltage / Vsup (V):	3
Additional Features:	ALSO CONFIGURABLE AS 256M X 1
Parallel or Serial:	SERIAL
Terminal Pitch:	1.27 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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