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THGBMNG5D1LBAIL
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ManufacturerKioxia Holdings
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Manufacturer's Part NumberTHGBMNG5D1LBAIL
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DescriptionFLASH CARD; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
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Datasheet
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DetailsTHGBMNG5D1LBAIL Technical Details
TYPE | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Organization: | 4GX8 |
Minimum Supply Voltage (Vsup): | 2.7 V |
Surface Mount: | YES |
No. of Terminals: | 153 |
No. of Words: | 4294967296 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B153 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Width: | 11 mm |
Memory Density: | 34359738368 bit |
Memory IC Type: | FLASH CARD |
Minimum Operating Temperature: | -25 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Package Equivalence Code: | BGA153,14X14,20 |
Length: | 13 mm |
No. of Words Code: | 4G |
Terminal Pitch: | .5 mm |
Temperature Grade: | OTHER |
Maximum Supply Voltage (Vsup): | 3.6 V |