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S29GL512P11FFI010
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ManufacturerSpansion
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Manufacturer's Part NumberS29GL512P11FFI010
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DescriptionFLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Page Size (words): 8/16;
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Datasheet
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DetailsS29GL512P11FFI010 Technical Details
TYPE | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Programming Voltage (V): | 3 |
Minimum Supply Voltage (Vsup): | 2.7 V |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Technology: | CMOS |
No. of Sectors/Size: | 512 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Package Code: | LBGA |
Moisture Sensitivity Level (MSL): | 3 |
Toggle Bit: | YES |
Memory Width: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA64,8X8,40 |
Alternate Memory Width: | 8 |
Ready or Busy: | YES |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1 mm |
Maximum Standby Current: | .000005 Amp |
Organization: | 512MX1 |
Maximum Seated Height: | 1.4 mm |
Maximum Supply Current: | 110 mA |
Command User Interface: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 64 |
No. of Words: | 536870912 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE |
JESD-30 Code: | R-PBGA-B64 |
Maximum Operating Temperature: | 85 Cel |
Width: | 11 mm |
Memory Density: | 536870912 bit |
Sector Size (Words): | 128K |
Memory IC Type: | FLASH |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Page Size (words): | 8/16 |
No. of Functions: | 1 |
Type: | NOR TYPE |
Common Flash Interface: | YES |
Length: | 13 mm |
Maximum Access Time: | 110 ns |
No. of Words Code: | 512M |
Nominal Supply Voltage / Vsup (V): | 3 |
Parallel or Serial: | PARALLEL |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.6 V |
Data Polling: | YES |
Power Supplies (V): | 3/3.3 |