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XNE556CU

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

XNE556CU
Description

PULSE; RECTANGULAR; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; JESD-30 Code: X-XUUC-N; Nominal Supply Voltage (Vsup): 5 V;
Datasheet

Datasheet

473 In Stock

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XNE556CU Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Minimum Supply Voltage (Vsup):	4.5 V
Surface Mount:	YES
No. of Functions:	2
Qualification:	Not Qualified
Terminal Position:	UPPER
Package Style (Meter):	UNCASED CHIP
Other IC type:	PULSE; RECTANGULAR
Technology:	BIPOLAR
JESD-30 Code:	X-XUUC-N
Package Shape:	UNSPECIFIED
Terminal Form:	NO LEAD
Package Code:	DIE
Nominal Supply Voltage (Vsup):	5 V
Maximum Supply Voltage (Vsup):	16 V

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