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XNE556CU
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberXNE556CU
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DescriptionPULSE; RECTANGULAR; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; JESD-30 Code: X-XUUC-N; Nominal Supply Voltage (Vsup): 5 V;
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Datasheet
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DetailsXNE556CU Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Minimum Supply Voltage (Vsup): | 4.5 V |
Surface Mount: | YES |
No. of Functions: | 2 |
Qualification: | Not Qualified |
Terminal Position: | UPPER |
Package Style (Meter): | UNCASED CHIP |
Other IC type: | PULSE; RECTANGULAR |
Technology: | BIPOLAR |
JESD-30 Code: | X-XUUC-N |
Package Shape: | UNSPECIFIED |
Terminal Form: | NO LEAD |
Package Code: | DIE |
Nominal Supply Voltage (Vsup): | 5 V |
Maximum Supply Voltage (Vsup): | 16 V |