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LM555CMM
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ManufacturerNational Semiconductor
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Manufacturer's Part NumberLM555CMM
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DescriptionPULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE; Surface Mount: YES;
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Datasheet
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DetailsLM555CMM Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Width (mm): | 3 mm |
| Maximum Seated Height: | 1.1 mm |
| Minimum Supply Voltage (Vsup): | 4.5 V |
| Sub-Category: | Analog Waveform Generation Functions |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Lead (Sn85Pb15) |
| No. of Terminals: | 8 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Technology: | BIPOLAR |
| JESD-30 Code: | S-PDSO-G8 |
| Package Shape: | SQUARE |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | TSSOP |
| Nominal Supply Voltage (Vsup): | 5 V |
| Moisture Sensitivity Level (MSL): | 1 |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP8,.19 |
| Other IC type: | PULSE; RECTANGULAR |
| Length: | 3 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 16 V |
| Power Supplies (V): | 5/15 |
