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ICM7555CD,602
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberICM7555CD,602
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DescriptionPULSE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
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Datasheet
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DetailsICM7555CD,602 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Width (mm): | 3.9 mm |
Maximum Seated Height: | 1.75 mm |
Minimum Supply Voltage (Vsup): | 3 V |
Sub-Category: | Analog Waveform Generation Functions |
Surface Mount: | YES |
No. of Terminals: | 8 |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-G8 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 70 Cel |
Package Code: | SOP |
Nominal Supply Voltage (Vsup): | 5 V |
Maximum Output Frequency: | .5 GHz |
Minimum Operating Temperature: | 0 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | SOP8,.25 |
Other IC type: | PULSE |
Length: | 4.9 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | COMMERCIAL |
Maximum Supply Voltage (Vsup): | 16 V |
Power Supplies (V): | 5/15 |