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NX18P3001UKZ
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberNX18P3001UKZ
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DescriptionPeripheral Drivers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 12; Package Code: FBGA; Package Shape: RECTANGULAR;
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Datasheet
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DetailsNX18P3001UKZ Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Driver No. of Bits: | 1 |
Sub-Category: | Peripheral Drivers |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 12 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA12,3X4,16 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
JESD-30 Code: | R-PBGA-B12 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Terminal Pitch: | .4 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 5,4/16 |
Moisture Sensitivity Level (MSL): | 1 |