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NTS0104BQ,115
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberNTS0104BQ,115
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DescriptionINTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVQCCN; Package Shape: RECTANGULAR;
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Datasheet
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DetailsNTS0104BQ,115 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Telecom IC Type: | INTERFACE CIRCUIT |
Maximum Seated Height: | 1 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 4 |
No. of Terminals: | 14 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Length: | 3 mm |
JESD-30 Code: | R-PQCC-N14 |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 125 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | HVQCCN |
Width: | 2.5 mm |
Terminal Pitch: | .5 mm |
Temperature Grade: | AUTOMOTIVE |
Moisture Sensitivity Level (MSL): | 1 |