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SJA1105PELY
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberSJA1105PELY
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DescriptionSUPPORT CIRCUIT; Terminal Form: BALL; No. of Terminals: 159; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 125 Cel;
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Datasheet
2293 In Stock
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DetailsSJA1105PELY Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Maximum Seated Height: | 1.5 mm |
| Surface Mount: | YES |
| Maximum Supply Current: | 200 mA |
| No. of Terminals: | 159 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Data Rate: | 1000 Mbps |
| Screening Level: | AEC-Q100 |
| JESD-30 Code: | S-PBGA-B159 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | LFBGA |
| Width: | 12 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Other Names: | 568-13849-2 935309153518 568-13849-1 568-13849-6 SJA1105PELY-ND |
| Telecom IC Type: | SUPPORT CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA159,14X14,32 |
| Length: | 12 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |