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SJA1105PELY

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

SJA1105PELY
Description

SUPPORT CIRCUIT; Terminal Form: BALL; No. of Terminals: 159; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 125 Cel;
Datasheet

Datasheet

2293 In Stock

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SJA1105PELY Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.2 V
Maximum Seated Height:	1.5 mm
Surface Mount:	YES
Maximum Supply Current:	200 mA
No. of Terminals:	159
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE, FINE PITCH
Data Rate:	1000 Mbps
Screening Level:	AEC-Q100
JESD-30 Code:	S-PBGA-B159
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	125 Cel
Package Code:	LFBGA
Width:	12 mm
Moisture Sensitivity Level (MSL):	3
Other Names:	568-13849-2 935309153518 568-13849-1 568-13849-6 SJA1105PELY-ND
Telecom IC Type:	SUPPORT CIRCUIT
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Package Equivalence Code:	BGA159,14X14,32
Length:	12 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.8 mm

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