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MC10XS3412CHFKR2

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

MC10XS3412CHFKR2
Description

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: BUTT; No. of Terminals: 16; Package Code: HBCC; Package Shape: SQUARE;
Datasheet

Datasheet

543 In Stock

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MC10XS3412CHFKR2 Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	6 V
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	12 V
Maximum Time At Peak Reflow Temperature (s):	40
Maximum Seated Height:	2.2 mm
Sub-Category:	Peripheral Drivers
Surface Mount:	YES
No. of Terminals:	16
Terminal Position:	BOTTOM
Package Style (Meter):	CHIP CARRIER, HEAT SINK/SLUG
JESD-30 Code:	S-XBCC-B16
Package Shape:	SQUARE
Terminal Form:	BUTT
Built-in Protections:	TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Maximum Operating Temperature:	125 Cel
Package Code:	HBCC
Interface IC Type:	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Width:	12 mm
Turn-off Time:	95 us
Moisture Sensitivity Level (MSL):	3
Driver No. of Bits:	4
Maximum Supply Voltage:	20 V
Turn-on Time:	95 us
Minimum Operating Temperature:	-40 Cel
No. of Functions:	4
Qualification:	Not Qualified
Package Equivalence Code:	LCC24(UNSPEC)
Output Current Flow Direction:	SINK
Length:	12 mm
Additional Features:	ALSO OPERATES WITH 4 TO 28 VOLTS
Peak Reflow Temperature (C):	260
Temperature Grade:	AUTOMOTIVE
Power Supplies (V):	3.3/5,6/20

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