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BA423AL115
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberBA423AL115
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DescriptionMIXER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
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Datasheet
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DetailsBA423AL115 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | GLASS |
Maximum Forward Voltage (VF): | .9 V |
Config: | SINGLE |
Diode Type: | MIXER DIODE |
Maximum Output Current: | 50 A |
Surface Mount: | YES |
Maximum Reverse Current: | .1 uA |
Diode Element Material: | SILICON |
No. of Terminals: | 2 |
Qualification: | Not Qualified |
Terminal Position: | END |
Maximum Diode Capacitance: | 2.5 pF |
Package Style (Meter): | LONG FORM |
JESD-30 Code: | O-LELF-R2 |
Minimum Breakdown Voltage: | 20 V |
No. of Elements: | 1 |
Package Shape: | ROUND |
Maximum Power Dissipation: | .21 W |
Terminal Form: | WRAP AROUND |
Maximum Operating Temperature: | 150 Cel |
Case Connection: | ISOLATED |