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555/BPA

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

555/BPA
Description

PULSE; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Datasheet

Datasheet

3570 In Stock

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555/BPA Technical Details

TYPE	DESCRIPTION
Package Body Material:	CERAMIC, GLASS-SEALED
Width (mm):	7.62 mm
Maximum Seated Height:	5.08 mm
Minimum Supply Voltage (Vsup):	4.5 V
Surface Mount:	NO
Minimum Operating Temperature:	-55 Cel
No. of Functions:	1
No. of Terminals:	8
Qualification:	Not Qualified
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Other IC type:	PULSE
Technology:	BIPOLAR
JESD-30 Code:	R-GDIP-T8
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Additional Features:	IT CAN ALSO OPERATE AT 15V NOM
Maximum Operating Temperature:	125 Cel
Package Code:	DIP
Nominal Supply Voltage (Vsup):	5 V
Terminal Pitch:	2.54 mm
Temperature Grade:	MILITARY
Maximum Supply Voltage (Vsup):	18 V

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