LMC555CMMX by National Semiconductor

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LMC555CMMX

  • Manufacturer
    National Semiconductor
  • Manufacturer's Part Number
    LMC555CMMX
  • Description
    PULSE; RECTANGULAR; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE; Surface Mount: YES;
  • Datasheet

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LMC555CMMX Technical Details

TYPE DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Width (mm): 3 mm
Maximum Seated Height: 1.09 mm
Minimum Supply Voltage (Vsup): 1.5 V
Sub-Category: Analog Waveform Generation Functions
Surface Mount: YES
Terminal Finish: Tin/Lead (Sn85Pb15)
No. of Terminals: 8
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: S-PDSO-G8
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Nominal Supply Voltage (Vsup): 5 V
Moisture Sensitivity Level (MSL): 1
Maximum Output Frequency: 3 GHz
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: TSSOP8,.19
Other IC type: PULSE; RECTANGULAR
Length: 3 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 12 V
Power Supplies (V): 1.5/12

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