LMC555CTP/NOPB by National Semiconductor

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LMC555CTP/NOPB

Manufacturer

National Semiconductor
Manufacturer's Part Number

LMC555CTP/NOPB
Description

PULSE; RECTANGULAR; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet

Datasheet

3542 In Stock

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LMC555CTP/NOPB Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	40
Width (mm):	1.387 mm
Minimum Supply Voltage (Vsup):	1.5 V
Sub-Category:	Analog Waveform Generation Functions
Surface Mount:	YES
Terminal Finish:	Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals:	8
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B8
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Nominal Supply Voltage (Vsup):	5 V
Moisture Sensitivity Level (MSL):	1
Maximum Output Frequency:	3 GHz
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA8,3X3,20
Other IC type:	PULSE; RECTANGULAR
Length:	1.412 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	12 V
Power Supplies (V):	1.5/12

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