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LMC555CTP/NOPB
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ManufacturerNational Semiconductor
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Manufacturer's Part NumberLMC555CTP/NOPB
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DescriptionPULSE; RECTANGULAR; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
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Datasheet
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LMC555CTP/NOPB Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Width (mm): | 1.387 mm |
| Minimum Supply Voltage (Vsup): | 1.5 V |
| Sub-Category: | Analog Waveform Generation Functions |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| No. of Terminals: | 8 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Nominal Supply Voltage (Vsup): | 5 V |
| Moisture Sensitivity Level (MSL): | 1 |
| Maximum Output Frequency: | 3 GHz |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA8,3X3,20 |
| Other IC type: | PULSE; RECTANGULAR |
| Length: | 1.412 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 12 V |
| Power Supplies (V): | 1.5/12 |
