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TLC556MJ/883B
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ManufacturerTexas Instruments
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Manufacturer's Part NumberTLC556MJ/883B
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DescriptionPULSE; RECTANGULAR; Temperature Grade: MILITARY; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
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Datasheet
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DetailsTLC556MJ/883B Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | CERAMIC, GLASS-SEALED |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Width (mm): | 7.62 mm |
Maximum Seated Height: | 5.08 mm |
Minimum Supply Voltage (Vsup): | 2 V |
Sub-Category: | Analog Waveform Generation Functions |
Surface Mount: | NO |
No. of Terminals: | 14 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Screening Level: | MIL-STD-883 Class B |
Technology: | CMOS |
JESD-30 Code: | R-GDIP-T14 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 125 Cel |
Package Code: | DIP |
Nominal Supply Voltage (Vsup): | 5 V |
Maximum Output Frequency: | 1.2 GHz |
Minimum Operating Temperature: | -55 Cel |
No. of Functions: | 2 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP14,.3 |
Other IC type: | PULSE; RECTANGULAR |
Length: | 19.94 mm |
Additional Features: | LG-MAX |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | MILITARY |
Maximum Supply Voltage (Vsup): | 15 V |
Power Supplies (V): | 5/18 |