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LM556J-MIL

Manufacturer

National Semiconductor
Manufacturer's Part Number

LM556J-MIL
Description

PULSE; RECTANGULAR; Temperature Grade: MILITARY; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Datasheet

Datasheet

387 In Stock

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LM556J-MIL Technical Details

TYPE	DESCRIPTION
Package Body Material:	CERAMIC, GLASS-SEALED
Maximum Time At Peak Reflow Temperature (s):	40
Width (mm):	7.62 mm
Maximum Seated Height:	5.08 mm
Minimum Supply Voltage (Vsup):	4.5 V
Sub-Category:	Analog Waveform Generation Functions
Surface Mount:	NO
Terminal Finish:	Tin/Lead (Sn63Pb37)
No. of Terminals:	14
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Screening Level:	MIL-STD-883
Technology:	BIPOLAR
JESD-30 Code:	R-GDIP-T14
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	125 Cel
Package Code:	DIP
Nominal Supply Voltage (Vsup):	5 V
Moisture Sensitivity Level (MSL):	1
JESD-609 Code:	e0
Minimum Operating Temperature:	-55 Cel
No. of Functions:	2
Qualification:	Not Qualified
Package Equivalence Code:	DIP14,.3
Other IC type:	PULSE; RECTANGULAR
Length:	19.43 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	2.54 mm
Temperature Grade:	MILITARY
Maximum Supply Voltage (Vsup):	16 V
Power Supplies (V):	5/15

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