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TS556MJ

Manufacturer

STMicroelectronics
Manufacturer's Part Number

TS556MJ
Description

Analog Waveform Generation Functions; Temperature Grade: MILITARY; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Datasheet

Datasheet

905 In Stock

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TS556MJ Technical Details

TYPE	DESCRIPTION
Package Body Material:	CERAMIC
Sub-Category:	Analog Waveform Generation Functions
Surface Mount:	NO
Terminal Finish:	Tin/Lead (Sn/Pb)
JESD-609 Code:	e0
Minimum Operating Temperature:	-55 Cel
No. of Terminals:	14
Qualification:	Not Qualified
Package Equivalence Code:	DIP14,.3
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	CMOS
JESD-30 Code:	R-XDIP-T14
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	125 Cel
Package Code:	DIP
Terminal Pitch:	2.54 mm
Temperature Grade:	MILITARY
Power Supplies (V):	5/18

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