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TS556MJ
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ManufacturerSTMicroelectronics
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Manufacturer's Part NumberTS556MJ
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DescriptionAnalog Waveform Generation Functions; Temperature Grade: MILITARY; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
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Datasheet
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DetailsTS556MJ Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC |
| Sub-Category: | Analog Waveform Generation Functions |
| Surface Mount: | NO |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -55 Cel |
| No. of Terminals: | 14 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP14,.3 |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | CMOS |
| JESD-30 Code: | R-XDIP-T14 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | DIP |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | MILITARY |
| Power Supplies (V): | 5/18 |
