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W3H64M72E-533SBI

Manufacturer

Microsemi
Manufacturer's Part Number

W3H64M72E-533SBI
Description

DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: BGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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W3H64M72E-533SBI Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	64MX72
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	30
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.7 V
Sub-Category:	DRAMs
Surface Mount:	YES
Maximum Supply Current:	1750 mA
No. of Terminals:	208
Maximum Clock Frequency (fCLK):	267 MHz
No. of Words:	67108864 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B208
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Input/Output Type:	COMMON
No. of Ports:	1
Memory Density:	4831838208 bit
Self Refresh:	YES
Memory IC Type:	DDR2 DRAM
Minimum Operating Temperature:	-40 Cel
Memory Width:	72
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA208,11X19,40
Refresh Cycles:	8192
Maximum Access Time:	.5 ns
No. of Words Code:	64M
Nominal Supply Voltage / Vsup (V):	1.8
Additional Features:	AUTO/SELF REFRESH
Peak Reflow Temperature (C):	225
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	1.9 V
Power Supplies (V):	1.8

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