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MTFC16GAPALBH-IT
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ManufacturerMicron Technology
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Manufacturer's Part NumberMTFC16GAPALBH-IT
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DescriptionFLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN SILVER COPPER;
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Datasheet
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DetailsMTFC16GAPALBH-IT Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 16GX8 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.1 mm |
| Programming Voltage (V): | 2.7 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 153 |
| Maximum Clock Frequency (fCLK): | 200 MHz |
| No. of Words: | 17179869184 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B153 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Width: | 11.5 mm |
| Memory Density: | 137438953472 bit |
| Memory IC Type: | FLASH CARD |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | NAND TYPE |
| Package Equivalence Code: | BGA153,14X14,20 |
| Length: | 13 mm |
| No. of Words Code: | 16G |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
