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W25Q64JVTBIQ

Manufacturer

Winbond Electronics
Manufacturer's Part Number

W25Q64JVTBIQ
Description

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words: 8388608 words;
Datasheet

Datasheet

Not In Stock

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W25Q64JVTBIQ Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00005 Amp
Organization:	8MX8
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	1.2 mm
Programming Voltage (V):	3.3
Minimum Supply Voltage (Vsup):	3 V
Surface Mount:	YES
Maximum Supply Current:	25 mA
No. of Terminals:	24
Maximum Clock Frequency (fCLK):	133 MHz
No. of Words:	8388608 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE
Write Protection:	HARDWARE/SOFTWARE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B24
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Endurance:	100000 Write/Erase Cycles
Package Code:	TBGA
Width:	6 mm
Serial Bus Type:	SPI
Memory Density:	67108864 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Type:	NOR TYPE
Package Equivalence Code:	BGA24,5X5,40
Alternate Memory Width:	1
Length:	8 mm
No. of Words Code:	8M
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	IT ALSO OPERATES AT 2.7V @ 104MHZ
Minimum Data Retention Time:	20
Peak Reflow Temperature (C):	NOT SPECIFIED
Parallel or Serial:	SERIAL
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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