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SDINBDG4-8G-XI2
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ManufacturerWestern Digital
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Manufacturer's Part NumberSDINBDG4-8G-XI2
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DescriptionFLASH CARD; Temperature Grade: INDUSTRIAL; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: BALL;
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Datasheet
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DetailsSDINBDG4-8G-XI2 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 8GX8 |
Maximum Seated Height: | .8 mm |
Minimum Supply Voltage (Vsup): | 2.7 V |
Surface Mount: | YES |
No. of Words: | 8589934592 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Technology: | CMOS |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Endurance: | 3000 Write/Erase Cycles |
Package Code: | VFBGA |
Width: | 11.5 mm |
Memory Density: | 68719476736 bit |
Memory IC Type: | FLASH CARD |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Type: | MLC NAND TYPE |
Length: | 13 mm |
No. of Words Code: | 8G |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.6 V |