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SDINBDG4-8G-XI2
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ManufacturerWestern Digital
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Manufacturer's Part NumberSDINBDG4-8G-XI2
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DescriptionFLASH CARD; Temperature Grade: INDUSTRIAL; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: BALL;
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Datasheet
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SDINBDG4-8G-XI2 Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 8GX8 |
| Maximum Seated Height: | .8 mm |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| No. of Words: | 8589934592 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 3000 Write/Erase Cycles |
| Package Code: | VFBGA |
| Width: | 11.5 mm |
| Memory Density: | 68719476736 bit |
| Memory IC Type: | FLASH CARD |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | MLC NAND TYPE |
| Length: | 13 mm |
| No. of Words Code: | 8G |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |