MSCSM170AM11CT3AG by Microchip Technology

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MSCSM170AM11CT3AG

Manufacturer

Microchip Technology
Manufacturer's Part Number

MSCSM170AM11CT3AG
Description

N-CHANNEL; Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; JESD-30 Code: R-XUFM-X25; Maximum Feedback Capacitance (Crss): 40 pF; Minimum DS Breakdown Voltage: 1700 V;
Datasheet

Datasheet

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MSCSM170AM11CT3AG Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Configuration:	SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
Transistor Element Material:	SILICON CARBIDE
Field Effect Transistor Technology:	METAL-OXIDE SEMICONDUCTOR
Transistor Application:	SWITCHING
Maximum Feedback Capacitance (Crss):	40 pF
Maximum Drain Current (ID):	240 A
Maximum Pulsed Drain Current (IDM):	480 A
Polarity or Channel Type:	N-CHANNEL
Surface Mount:	NO
Minimum Operating Temperature:	-40 Cel
No. of Terminals:	25
Minimum DS Breakdown Voltage:	1700 V
Terminal Position:	UPPER
Package Style (Meter):	FLANGE MOUNT
JESD-30 Code:	R-XUFM-X25
No. of Elements:	2
Package Shape:	RECTANGULAR
Terminal Form:	UNSPECIFIED
Operating Mode:	ENHANCEMENT MODE
Maximum Operating Temperature:	175 Cel
Case Connection:	ISOLATED
Maximum Drain-Source On Resistance:	.0113 ohm

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MSCSM170AM11CT3AG Technical Details

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