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MSCSM170AM11CT3AG
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ManufacturerMicrochip Technology
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Manufacturer's Part NumberMSCSM170AM11CT3AG
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DescriptionN-CHANNEL; Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; JESD-30 Code: R-XUFM-X25; Maximum Feedback Capacitance (Crss): 40 pF; Minimum DS Breakdown Voltage: 1700 V;
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Datasheet
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DetailsMSCSM170AM11CT3AG Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Other Names: | 150-MSCSM170AM11CT3AG |
| Package Body Material: | UNSPECIFIED |
| Configuration: | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR |
| Transistor Element Material: | SILICON CARBIDE |
| Field Effect Transistor Technology: | METAL-OXIDE SEMICONDUCTOR |
| Transistor Application: | SWITCHING |
| Maximum Feedback Capacitance (Crss): | 40 pF |
| Maximum Drain Current (ID): | 240 A |
| Maximum Pulsed Drain Current (IDM): | 480 A |
| Polarity or Channel Type: | N-CHANNEL |
| Surface Mount: | NO |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 25 |
| Minimum DS Breakdown Voltage: | 1700 V |
| Terminal Position: | UPPER |
| Package Style (Meter): | FLANGE MOUNT |
| JESD-30 Code: | R-XUFM-X25 |
| No. of Elements: | 2 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | UNSPECIFIED |
| Operating Mode: | ENHANCEMENT MODE |
| Maximum Operating Temperature: | 175 Cel |
| Case Connection: | ISOLATED |
| Maximum Drain-Source On Resistance: | .0113 ohm |