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MD0100N8-G
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ManufacturerMicrochip Technology
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Manufacturer's Part NumberMD0100N8-G
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DescriptionTELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: FLAT; No. of Terminals: 3; Package Code: LSOF; Package Shape: RECTANGULAR;
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Datasheet
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DetailsMD0100N8-G Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.6 mm |
Surface Mount: | YES |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 3 |
Terminal Position: | SINGLE |
Package Style (Meter): | SMALL OUTLINE, LOW PROFILE |
Screening Level: | TS 16949 |
JESD-30 Code: | R-PSSO-F3 |
Package Shape: | RECTANGULAR |
Terminal Form: | FLAT |
Maximum Operating Temperature: | 125 Cel |
Package Code: | LSOF |
Width: | 2.445 mm |
Moisture Sensitivity Level (MSL): | 1 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Package Equivalence Code: | TO-243 |
Length: | 4.5 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1.5 mm |
Temperature Grade: | AUTOMOTIVE |