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SL3S1002FTB1,115

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

SL3S1002FTB1,115
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 3; Package Code: BCC; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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SL3S1002FTB1,115 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	.5 mm
Sub-Category:	Other Telecom ICs
Surface Mount:	YES
Terminal Finish:	TIN
No. of Terminals:	3
Terminal Position:	BOTTOM
Package Style (Meter):	CHIP CARRIER
Technology:	CMOS
JESD-30 Code:	R-PBCC-B3
Package Shape:	RECTANGULAR
Terminal Form:	BUTT
Maximum Operating Temperature:	85 Cel
Package Code:	BCC
Width:	1 mm
Moisture Sensitivity Level (MSL):	1
Telecom IC Type:	TELECOM CIRCUIT
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	LCC3(UNSPEC)
Length:	1.45 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.55 mm
Temperature Grade:	INDUSTRIAL

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