BGS12SN6E6327XTSA1 by Infineon Technologies

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BGS12SN6E6327XTSA1

Manufacturer

Infineon Technologies
Manufacturer's Part Number

BGS12SN6E6327XTSA1
Description

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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BGS12SN6E6327XTSA1 Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	2.6 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	.4 mm
Surface Mount:	YES
Terminal Finish:	TIN
JESD-609 Code:	e3
Minimum Operating Temperature:	-30 Cel
No. of Functions:	1
No. of Terminals:	6
Terminal Position:	BOTTOM
Package Style (Meter):	CHIP CARRIER
Length:	1.1 mm
JESD-30 Code:	R-XBCC-B6
Package Shape:	RECTANGULAR
Terminal Form:	BUTT
Maximum Operating Temperature:	85 Cel
Package Code:	BCC
Width:	.7 mm
Terminal Pitch:	.4 mm
Temperature Grade:	OTHER
Moisture Sensitivity Level (MSL):	1

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