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BMD-330-A-R

Manufacturer

U-blox Ag
Manufacturer's Part Number

BMD-330-A-R
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: XMA; Package Shape: RECTANGULAR; Data Rate: 2 Mbps;
Datasheet

Datasheet

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BMD-330-A-R Technical Details

TYPE	DESCRIPTION
Other Names:	1604-1024-2-ND BMD-330-A-R-00 1604-1024-1-ND 672-BMD-330-A-R-00TR-ND 1604-1024-6 672-BMD-330-A-R-00DKR-ND 672-BMD-330-A-RTR 1604-1024-2 1604-1024-6-ND BMD-330-A-R-10 1604-1024-1 672-BMD-330-A-RCT 672-BMD-330-A-R-00CT-ND 672-BMD-330-A-RDKR
Package Body Material:	UNSPECIFIED
Telecom IC Type:	TELECOM CIRCUIT
Surface Mount:	YES
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Terminal Position:	UNSPECIFIED
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Data Rate:	2 Mbps
JESD-30 Code:	R-XXMA-N
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Maximum Operating Temperature:	85 Cel
Peak Reflow Temperature (C):	250
Package Code:	XMA
Temperature Grade:	INDUSTRIAL
Moisture Sensitivity Level (MSL):	3

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