S29GL256P10TFI010 by Advanced Micro Devices

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S29GL256P10TFI010

Manufacturer

Advanced Micro Devices
Manufacturer's Part Number

S29GL256P10TFI010
Description

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP56,.8,20;
Datasheet

Datasheet

669 In Stock

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S29GL256P10TFI010 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.000005 Amp
Organization:	16MX16
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	80 mA
Command User Interface:	YES
No. of Terminals:	56
No. of Words:	16777216 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	CMOS
JESD-30 Code:	R-PDSO-G56
No. of Sectors/Size:	256
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	TSSOP
Memory Density:	268435456 bit
Sector Size (Words):	128K
Toggle Bit:	YES
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
Page Size (words):	8/16
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	TSSOP56,.8,20
Alternate Memory Width:	8
Common Flash Interface:	YES
Maximum Access Time:	100 ns
No. of Words Code:	16M
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Data Polling:	YES
Power Supplies (V):	3/3.3

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