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W956D8MBYA5I

Manufacturer

Winbond Electronics
Manufacturer's Part Number

W956D8MBYA5I
Description

HYPERRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words Code: 8M; Memory Width: 8;
Datasheet

Datasheet

Not In Stock

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W956D8MBYA5I Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00025 Amp
Organization:	8MX8
Maximum Seated Height:	1.2 mm
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
Maximum Supply Current:	30 mA
No. of Terminals:	24
Maximum Clock Frequency (fCLK):	200 MHz
No. of Words:	8388608 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B24
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TBGA
Width:	6 mm
Other Names:	256-W956D8MBYA5I
Input/Output Type:	COMMON
No. of Ports:	1
Memory Density:	67108864 bit
Self Refresh:	YES
Memory IC Type:	HYPERRAM
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Package Equivalence Code:	BGA24,5X5,40
Length:	8 mm
No. of Words Code:	8M
Nominal Supply Voltage / Vsup (V):	1.8
Additional Features:	AUTO/SELF REFRESH
Terminal Pitch:	1 mm
Maximum Supply Voltage (Vsup):	2 V

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