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W66CP2NQUAFJ

Manufacturer

Winbond Electronics
Manufacturer's Part Number

W66CP2NQUAFJ
Description

LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words Code: 128M; JESD-30 Code: R-PBGA-B200;
Datasheet

Datasheet

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W66CP2NQUAFJ Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	128MX32
Maximum Seated Height:	.8 mm
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.06 V
Surface Mount:	YES
No. of Terminals:	200
Maximum Clock Frequency (fCLK):	1600 MHz
No. of Words:	134217728 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B200
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	105 Cel
Package Code:	VFBGA
Width:	10 mm
Other Names:	256-W66CP2NQUAFJ
Input/Output Type:	COMMON
No. of Ports:	1
Memory Density:	4294967296 bit
Self Refresh:	YES
Sequential Burst Length:	16,32
Memory IC Type:	LPDDR4 DRAM
Minimum Operating Temperature:	-40 Cel
Memory Width:	32
No. of Functions:	1
Package Equivalence Code:	BGA200,12X22,32/25
Interleaved Burst Length:	16,32
Length:	14.5 mm
No. of Words Code:	128M
Nominal Supply Voltage / Vsup (V):	1.1
Additional Features:	AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; TERM PITCH-MAX
Terminal Pitch:	.8 mm
Maximum Supply Voltage (Vsup):	1.17 V

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