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W25Q64FVSSIG

Manufacturer

Winbond Electronics
Manufacturer's Part Number

W25Q64FVSSIG
Description

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Maximum Standby Current: .00005 Amp;
Datasheet

Datasheet

Not In Stock

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W25Q64FVSSIG Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00005 Amp
Organization:	8MX8
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	2.16 mm
Minimum Supply Voltage (Vsup):	3 V
Surface Mount:	YES
Terminal Finish:	MATTE TIN
No. of Terminals:	8
Maximum Clock Frequency (fCLK):	104 MHz
No. of Words:	8388608 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE
Write Protection:	HARDWARE/SOFTWARE
Technology:	CMOS
JESD-30 Code:	S-PDSO-G8
Package Shape:	SQUARE
Terminal Form:	GULL WING
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	SOP
Width:	5.28 mm
Moisture Sensitivity Level (MSL):	3
Serial Bus Type:	SPI
Memory Density:	67108864 bit
Memory IC Type:	FLASH
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	SOP8,.3
Alternate Memory Width:	1
Length:	5.28 mm
No. of Words Code:	8M
Minimum Data Retention Time:	20
Peak Reflow Temperature (C):	260
Parallel or Serial:	SERIAL
Terminal Pitch:	1.27 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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