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W25Q64FVSSIG
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ManufacturerWinbond Electronics
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Manufacturer's Part NumberW25Q64FVSSIG
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DescriptionFLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Maximum Standby Current: .00005 Amp;
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Datasheet
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DetailsW25Q64FVSSIG Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 8MX8 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.16 mm |
| Minimum Supply Voltage (Vsup): | 3 V |
| Surface Mount: | YES |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 8 |
| Maximum Clock Frequency (fCLK): | 104 MHz |
| No. of Words: | 8388608 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE |
| Write Protection: | HARDWARE/SOFTWARE |
| Technology: | CMOS |
| JESD-30 Code: | S-PDSO-G8 |
| Package Shape: | SQUARE |
| Terminal Form: | GULL WING |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | SOP |
| Width: | 5.28 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Serial Bus Type: | SPI |
| Memory Density: | 67108864 bit |
| Memory IC Type: | FLASH |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SOP8,.3 |
| Alternate Memory Width: | 1 |
| Length: | 5.28 mm |
| No. of Words Code: | 8M |
| Minimum Data Retention Time: | 20 |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
