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W25Q16JVUXIQ

Manufacturer

Winbond Electronics
Manufacturer's Part Number

W25Q16JVUXIQ
Description

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Memory Density: 16777216 bit;
Datasheet

Datasheet

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W25Q16JVUXIQ Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	2MX8
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	.6 mm
Programming Voltage (V):	3
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	8
Maximum Clock Frequency (fCLK):	133 MHz
No. of Words:	2097152 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PDSO-N8
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	HVSON
Width:	2 mm
Memory Density:	16777216 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Length:	3 mm
No. of Words Code:	2M
Nominal Supply Voltage / Vsup (V):	3
Peak Reflow Temperature (C):	NOT SPECIFIED
Parallel or Serial:	SERIAL
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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