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CC2564BYFVR-XI
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ManufacturerTexas Instruments
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Manufacturer's Part NumberCC2564BYFVR-XI
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 54; Package Code: VFBGA; Package Shape: RECTANGULAR;
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Datasheet
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DetailsCC2564BYFVR-XI Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 3.6 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .575 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 54 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Data Rate: | 4 Mbps |
| JESD-30 Code: | R-XBGA-B54 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | 2.93 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Length: | 3.26 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |