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CC2564BYFVR-XI
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ManufacturerTexas Instruments
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Manufacturer's Part NumberCC2564BYFVR-XI
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 54; Package Code: VFBGA; Package Shape: RECTANGULAR;
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Datasheet
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DetailsCC2564BYFVR-XI Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Nominal Supply Voltage: | 3.6 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .575 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 54 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Data Rate: | 4 Mbps |
JESD-30 Code: | R-XBGA-B54 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFBGA |
Width: | 2.93 mm |
Moisture Sensitivity Level (MSL): | 1 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Length: | 3.26 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .4 mm |
Temperature Grade: | INDUSTRIAL |