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BM71BLES1FC2-0B02AA
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ManufacturerMicrochip Technology
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Manufacturer's Part NumberBM71BLES1FC2-0B02AA
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: XMA; Package Shape: RECTANGULAR;
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Datasheet
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DetailsBM71BLES1FC2-0B02AA Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 2.16 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 16 |
| Package Equivalence Code: | MODULE,16LEAD(UNSPEC) |
| Terminal Position: | UNSPECIFIED |
| Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
| Data Rate: | .0086 Mbps |
| Length: | 11.5 mm |
| JESD-30 Code: | R-XXMA-N16 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | XMA |
| Width: | 9 mm |
| Terminal Pitch: | 1.2 mm |
| Temperature Grade: | INDUSTRIAL |