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BQ51013BYFPR
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ManufacturerTexas Instruments
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Manufacturer's Part NumberBQ51013BYFPR
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DescriptionTELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 28; Package Code: VFBGA; Package Shape: RECTANGULAR;
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Datasheet
674 In Stock
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DetailsBQ51013BYFPR Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 5 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .5 mm |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| No. of Terminals: | 28 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Data Rate: | .002 Mbps |
| JESD-30 Code: | R-XBGA-B28 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | VFBGA |
| Width: | 1.88 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Other Names: | BQ51013BYFPR-ND TEXTISBQ51013BYFPR 296-39955-6 296-39955-2 296-39955-1 -296-39955-1-ND 2156-BQ51013BYFPR |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Length: | 3 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | AUTOMOTIVE |
