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EQCO30T5.2

Manufacturer

Microchip Technology
Manufacturer's Part Number

EQCO30T5.2
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
Datasheet

Datasheet

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EQCO30T5.2 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	30
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	.95 mm
Surface Mount:	YES
Terminal Finish:	NICKEL PALLADIUM GOLD
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	16
Terminal Position:	QUAD
Package Style (Meter):	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Length:	4 mm
JESD-30 Code:	S-PQCC-N16
Package Shape:	SQUARE
Terminal Form:	NO LEAD
Maximum Operating Temperature:	85 Cel
Peak Reflow Temperature (C):	260
Package Code:	HVQCCN
Width:	4 mm
Terminal Pitch:	.65 mm
Temperature Grade:	INDUSTRIAL
Moisture Sensitivity Level (MSL):	1

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