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BGM11S22F256GA-V2
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ManufacturerSilicon Labs
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Manufacturer's Part NumberBGM11S22F256GA-V2
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DescriptionTELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e4; Terminal Finish: NICKEL GOLD;
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Datasheet
457 In Stock
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DetailsBGM11S22F256GA-V2 Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Other Names: | 336-4041 |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Peak Reflow Temperature (C): | 260 |
| Terminal Finish: | NICKEL GOLD |
| JESD-609 Code: | e4 |
| Moisture Sensitivity Level (MSL): | 3 |
