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LSM303DLHC

Manufacturer

STMicroelectronics
Manufacturer's Part Number

LSM303DLHC
Description

ANALOG CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 14; Package Code: VFLGA; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet

Datasheet

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LSM303DLHC Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	30
Width (mm):	3 mm
Maximum Seated Height:	1 mm
Minimum Supply Voltage (Vsup):	2.16 V
Surface Mount:	YES
Terminal Finish:	Nickel/Gold (Ni/Au)
No. of Terminals:	14
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-BU14
Package Shape:	RECTANGULAR
Terminal Form:	BUTT
Maximum Operating Temperature:	85 Cel
Package Code:	VFLGA
Nominal Supply Voltage (Vsup):	2.5 V
Moisture Sensitivity Level (MSL):	3
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	LCC14,.12X.2,32
Other IC type:	ANALOG CIRCUIT
Length:	5 mm
Peak Reflow Temperature (C):	225
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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