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BGM113A256V2

Manufacturer

Silicon Labs
Manufacturer's Part Number

BGM113A256V2
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Shape: RECTANGULAR; Width: 9.15 mm;
Datasheet

Datasheet

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BGM113A256V2 Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	3.3 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	2 mm
Surface Mount:	YES
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	36
Terminal Position:	UNSPECIFIED
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Length:	15.73 mm
JESD-30 Code:	R-XXMA-N36
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Maximum Operating Temperature:	85 Cel
Width:	9.15 mm
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL

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