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SA638

Manufacturer

Philips Semiconductors
Manufacturer's Part Number

SA638
Description

Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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SA638 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3 V
Sub-Category:	Other Telecom ICs
Surface Mount:	YES
Terminal Finish:	Tin/Lead (Sn/Pb)
JESD-609 Code:	e0
Minimum Operating Temperature:	-40 Cel
No. of Terminals:	24
Qualification:	Not Qualified
Package Equivalence Code:	TSSOP24,.25
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	BICMOS
JESD-30 Code:	R-PDSO-G24
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	TSSOP
Terminal Pitch:	.635 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	3

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