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SE555FE883B
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberSE555FE883B
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DescriptionSQUARE; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
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Datasheet
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DetailsSE555FE883B Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | CERAMIC, GLASS-SEALED |
Width (mm): | 7.62 mm |
Maximum Seated Height: | 5.08 mm |
Minimum Supply Voltage (Vsup): | 4.5 V |
Surface Mount: | NO |
Minimum Operating Temperature: | -55 Cel |
No. of Functions: | 1 |
No. of Terminals: | 8 |
Qualification: | Not Qualified |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Other IC type: | SQUARE |
Screening Level: | MIL-STD-883 Class B |
Length: | 9.955 mm |
JESD-30 Code: | R-GDIP-T8 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 125 Cel |
Package Code: | DIP |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | MILITARY |
Maximum Supply Voltage (Vsup): | 18 V |