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SE555FE883B

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

SE555FE883B
Description

SQUARE; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Datasheet

Datasheet

3049 In Stock

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SE555FE883B Technical Details

TYPE	DESCRIPTION
Package Body Material:	CERAMIC, GLASS-SEALED
Width (mm):	7.62 mm
Maximum Seated Height:	5.08 mm
Minimum Supply Voltage (Vsup):	4.5 V
Surface Mount:	NO
Minimum Operating Temperature:	-55 Cel
No. of Functions:	1
No. of Terminals:	8
Qualification:	Not Qualified
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Other IC type:	SQUARE
Screening Level:	MIL-STD-883 Class B
Length:	9.955 mm
JESD-30 Code:	R-GDIP-T8
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	125 Cel
Package Code:	DIP
Terminal Pitch:	2.54 mm
Temperature Grade:	MILITARY
Maximum Supply Voltage (Vsup):	18 V

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