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SE555CFE

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

SE555CFE
Description

SQUARE; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Datasheet

Datasheet

4387 In Stock

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SE555CFE Technical Details

TYPE	DESCRIPTION
Package Body Material:	CERAMIC, GLASS-SEALED
Width (mm):	7.62 mm
Maximum Seated Height:	5.08 mm
Minimum Supply Voltage (Vsup):	4.5 V
Maximum Supply Current (Isup):	15 mA
Sub-Category:	Analog Waveform Generation Functions
Surface Mount:	NO
No. of Terminals:	8
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	BIPOLAR
JESD-30 Code:	R-GDIP-T8
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	125 Cel
Package Code:	DIP
Minimum Operating Temperature:	-55 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	DIP8,.3
Other IC type:	SQUARE
Length:	9.955 mm
Terminal Pitch:	2.54 mm
Temperature Grade:	MILITARY
Maximum Supply Voltage (Vsup):	16 V
Power Supplies (V):	5/15

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