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MK70FN1M0VMJ15

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

MK70FN1M0VMJ15
Description

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Datasheet

Datasheet

1574 In Stock

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MK70FN1M0VMJ15 Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	1.71 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	40
Sub-Category:	Microcontrollers
Surface Mount:	YES
Maximum Supply Current:	210 mA
Terminal Finish:	TIN SILVER COPPER
ADC Channels:	YES
No. of Terminals:	256
DMA Channels:	YES
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
No. of I/O Lines:	128
Address Bus Width:	0
Technology:	CMOS
JESD-30 Code:	S-PBGA-B256
Maximum Clock Frequency:	60 MHz
Package Shape:	SQUARE
ROM Words:	1048576
Terminal Form:	BALL
Maximum Operating Temperature:	105 Cel
Package Code:	BGA
Width:	17 mm
Moisture Sensitivity Level (MSL):	3
Speed:	150 rpm
Peripheral IC Type:	MICROCONTROLLER, RISC
Maximum Supply Voltage:	3.6 V
RAM Bytes:	131072
External Data Bus Width:	0
Bit Size:	32
DAC Channels:	YES
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA256,16X16,40
Length:	17 mm
PWM Channels:	YES
Peak Reflow Temperature (C):	260
ROM Programmability:	FLASH
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	1.8/3.3
CPU Family:	CORTEX-M4F

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