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MC68HC11E1CFNE2
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberMC68HC11E1CFNE2
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DescriptionMICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE;
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Datasheet
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DetailsMC68HC11E1CFNE2 Technical Details
TYPE | DESCRIPTION |
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Minimum Supply Voltage: | 4.5 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 5 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 5.08 mm |
Surface Mount: | YES |
Terminal Finish: | TIN |
ADC Channels: | YES |
No. of Terminals: | 52 |
DMA Channels: | NO |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER |
No. of I/O Lines: | 38 |
Address Bus Width: | 16 |
Technology: | HCMOS |
JESD-30 Code: | S-PQCC-J52 |
Maximum Clock Frequency: | 8 MHz |
Package Shape: | SQUARE |
Terminal Form: | J BEND |
Maximum Operating Temperature: | 85 Cel |
Package Code: | QCCJ |
Width: | 19.125 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 2 rpm |
Peripheral IC Type: | MICROCONTROLLER |
Maximum Supply Voltage: | 5.5 V |
External Data Bus Width: | 8 |
Bit Size: | 8 |
DAC Channels: | NO |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Length: | 19.125 mm |
PWM Channels: | NO |
Additional Features: | SEATED HT-CALCULATED |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | INDUSTRIAL |