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MAX7311AUG+

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

MAX7311AUG+
Description

Parallel IO Ports; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet

3662 In Stock

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MAX7311AUG+ Technical Details

TYPE	DESCRIPTION
No. of Bits:	16
Package Body Material:	PLASTIC/EPOXY
Sub-Category:	Parallel IO Port
Surface Mount:	YES
Minimum Operating Temperature:	-40 Cel
No. of Terminals:	24
Qualification:	Not Qualified
Package Equivalence Code:	TSSOP24,.25
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	BICMOS
JESD-30 Code:	R-PDSO-G24
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	125 Cel
Package Code:	TSSOP
Terminal Pitch:	.635 mm
Temperature Grade:	AUTOMOTIVE
Power Supplies (V):	2/5.5

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