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MAX7313ATG+
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ManufacturerAnalog Devices
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Manufacturer's Part NumberMAX7313ATG+
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DescriptionPARALLEL IO PORT, GENERAL PURPOSE; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
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Datasheet
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DetailsMAX7313ATG+ Technical Details
TYPE | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 2 V |
Package Body Material: | UNSPECIFIED |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .8 mm |
Sub-Category: | Parallel IO Port |
Surface Mount: | YES |
Terminal Finish: | Matte Tin (Sn) - annealed |
No. of Terminals: | 24 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
No. of I/O Lines: | 16 |
Technology: | BICMOS |
JESD-30 Code: | S-XQCC-N24 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 125 Cel |
Package Code: | HVQCCN |
Width: | 4 mm |
Moisture Sensitivity Level (MSL): | 1 |
No. of Bits: | 1 |
No. of Ports: | 1 |
Peripheral IC Type: | PARALLEL IO PORT, GENERAL PURPOSE |
Maximum Supply Voltage: | 3.6 V |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | LCC24,.16SQ,20 |
Length: | 4 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | AUTOMOTIVE |
Power Supplies (V): | 2.5/3.3 |