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LPC1769FBD100,551
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberLPC1769FBD100,551
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DescriptionMICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
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Datasheet
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DetailsLPC1769FBD100,551 Technical Details
TYPE | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 2.4 V |
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Address Bus Width: | 0 |
Technology: | CMOS |
Maximum Clock Frequency: | 25 MHz |
Package Shape: | SQUARE |
Terminal Form: | GULL WING |
Package Code: | LFQFP |
Moisture Sensitivity Level (MSL): | 3 |
Bit Size: | 32 |
DAC Channels: | YES |
Qualification: | Not Qualified |
Package Equivalence Code: | QFP100,.63SQ,20 |
Digital To Analog Convertors: | 1-Ch 12-Bit |
PWM Channels: | YES |
Connectivity: | CAN(2), ETHERNET, I2C(3), I2S, SSP, UART(4), USB |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Analog To Digital Convertors: | 8-Ch 12-Bit |
Terminal Pitch: | .5 mm |
CPU Family: | CORTEX-M3 |
Nominal Supply Voltage: | 3.3 V |
Maximum Seated Height: | 1.6 mm |
Terminal Finish: | TIN |
ADC Channels: | YES |
No. of Terminals: | 100 |
DMA Channels: | YES |
Terminal Position: | QUAD |
Package Style (Meter): | FLATPACK, LOW PROFILE, FINE PITCH |
No. of I/O Lines: | 70 |
JESD-30 Code: | S-PQFP-G100 |
ROM Words: | 524288 |
Maximum Operating Temperature: | 85 Cel |
Width: | 14 mm |
Data EEPROM Size: | 0 |
Speed: | 120 rpm |
Peripheral IC Type: | MICROCONTROLLER |
Maximum Supply Voltage: | 3.6 V |
RAM Bytes: | 65536 |
External Data Bus Width: | 0 |
Peripherals: | BOD, COMPARATOR, DMA(8), PWM(6), RTC, TIMER(6), WDT |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Length: | 14 mm |
On Chip Program ROM Width: | 8 |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3 |