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LPC1769FBD100,551
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberLPC1769FBD100,551
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DescriptionMICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
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Datasheet
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DetailsLPC1769FBD100,551 Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.4 V |
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Address Bus Width: | 0 |
| Technology: | CMOS |
| Maximum Clock Frequency: | 25 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | GULL WING |
| Package Code: | LFQFP |
| Moisture Sensitivity Level (MSL): | 3 |
| Bit Size: | 32 |
| DAC Channels: | YES |
| Qualification: | Not Qualified |
| Package Equivalence Code: | QFP100,.63SQ,20 |
| Digital To Analog Convertors: | 1-Ch 12-Bit |
| PWM Channels: | YES |
| Connectivity: | CAN(2), ETHERNET, I2C(3), I2S, SSP, UART(4), USB |
| Peak Reflow Temperature (C): | 260 |
| ROM Programmability: | FLASH |
| Analog To Digital Convertors: | 8-Ch 12-Bit |
| Terminal Pitch: | .5 mm |
| CPU Family: | CORTEX-M3 |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Seated Height: | 1.6 mm |
| Terminal Finish: | TIN |
| ADC Channels: | YES |
| No. of Terminals: | 100 |
| DMA Channels: | YES |
| Terminal Position: | QUAD |
| Package Style (Meter): | FLATPACK, LOW PROFILE, FINE PITCH |
| No. of I/O Lines: | 70 |
| JESD-30 Code: | S-PQFP-G100 |
| ROM Words: | 524288 |
| Maximum Operating Temperature: | 85 Cel |
| Width: | 14 mm |
| Other Names: | NXPNXPLPC1769FBD100551 LPC1769FBD100551 568-4966 935290522551 2156-LPC1769FBD100,551 |
| Data EEPROM Size: | 0 |
| Speed: | 120 rpm |
| Peripheral IC Type: | MICROCONTROLLER |
| Maximum Supply Voltage: | 3.6 V |
| RAM Bytes: | 65536 |
| External Data Bus Width: | 0 |
| Peripherals: | BOD, COMPARATOR, DMA(8), PWM(6), RTC, TIMER(6), WDT |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Length: | 14 mm |
| On Chip Program ROM Width: | 8 |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3.3 |