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LPC1768FBD100

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

LPC1768FBD100
Description

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
Datasheet

Datasheet

3263 In Stock

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LPC1768FBD100 Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	2.4 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.6 mm
Sub-Category:	Microcontrollers
Surface Mount:	YES
Terminal Finish:	TIN
ADC Channels:	YES
No. of Terminals:	100
DMA Channels:	YES
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK, LOW PROFILE, FINE PITCH
No. of I/O Lines:	70
Address Bus Width:	0
Technology:	CMOS
JESD-30 Code:	S-PQFP-G100
Maximum Clock Frequency:	25 MHz
Package Shape:	SQUARE
ROM Words:	131072
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	LFQFP
Width:	14 mm
Moisture Sensitivity Level (MSL):	3
Speed:	100 rpm
Peripheral IC Type:	MICROCONTROLLER, RISC
Maximum Supply Voltage:	3.6 V
RAM Bytes:	65536
External Data Bus Width:	0
Bit Size:	32
DAC Channels:	YES
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	QFP100,.63SQ,20
Length:	14 mm
PWM Channels:	YES
Peak Reflow Temperature (C):	260
ROM Programmability:	FLASH
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	2.5/3.3
CPU Family:	ARM7

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