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ICM7555IN,602
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberICM7555IN,602
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DescriptionPULSE; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
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Datasheet
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DetailsICM7555IN,602 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Width (mm): | 7.62 mm |
Maximum Seated Height: | 4.2 mm |
Minimum Supply Voltage (Vsup): | 3 V |
Sub-Category: | Analog Waveform Generation Functions |
Surface Mount: | NO |
No. of Terminals: | 8 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | CMOS |
JESD-30 Code: | R-PDIP-T8 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 85 Cel |
Package Code: | DIP |
Nominal Supply Voltage (Vsup): | 5 V |
Maximum Output Frequency: | .5 GHz |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP8,.3 |
Other IC type: | PULSE |
Length: | 9.5 mm |
Peak Reflow Temperature (C): | 250 |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 16 V |
Power Supplies (V): | 5/15 |